Sn7Au is a tin-gold intermetallic compound belonging to the Sn-Au binary system, likely representing a phase-stable composition in this alloy family. This material is primarily of interest in microelectronics and precious metal joining applications, where controlled intermetallic formation is either exploited for reliability or managed to prevent brittleness. The tin-gold system is notable in lead-free solder development and hybrid integrated circuit packaging, where specific tin-to-gold ratios influence mechanical performance and thermal cycling resistance compared to conventional lead-tin solders.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.099 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.09100 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.03794 | eV/atom | — |