Sn667Au333

metal

· Sn667Au333

Sn667Au333 is a tin-gold binary intermetallic alloy with approximately 67% tin and 33% gold by composition. This material belongs to the Sn-Au system, which has been studied for applications requiring combinations of tin's solderability and gold's corrosion resistance and thermal stability. The alloy is primarily of research and specialized industrial interest, used in electronics packaging, high-reliability interconnections, and thin-film applications where the Sn-Au phase diagram offers advantages over conventional solders or pure metallic coatings.

microelectronics interconnectsbump metallurgy (BGA/flip-chip)barrier coatingshigh-reliability solder applicationsthin-film depositionresearch/specialty electronics

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1472	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Sn667Au333

Other Properties

Regulatory Screening

Environmental

Export Control