Sn4Au is an intermetallic compound in the tin-gold system, representing a discrete phase that forms at specific composition ratios. This material belongs to a family of precious-metal intermetallics historically important in electronics and jewelry, though Sn4Au itself is primarily encountered in research contexts and as a phase constituent in lead-free solder systems and gold-tin bonding applications. Its notable characteristics stem from the combination of tin's low melting point with gold's chemical stability and conductivity, making it relevant where hermetic sealing, thermal management, or corrosion resistance in miniaturized assemblies is required.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 51.21 | GPa | — | ||
| ↳ | 51.21 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 3.358 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν) | 0.3972 | - | — | ||
Shear Modulus(G)2 entries | 11.30 | GPa | — | ||
| ↳ | 11.30 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.437 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000300 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.08190 | eV/atom | — | ||
| ↳ | -0.08464 | eV/atom | — |