Sn3Pd is an intermetallic compound combining tin and palladium, belonging to the class of metallic ceramics or hard intermetallic phases. This material exhibits high stiffness and density, making it relevant for applications requiring structural rigidity and wear resistance in demanding environments. Sn3Pd is primarily explored in research contexts for electronics packaging, lead-free solder systems, and thermal management applications, where palladium-tin phases offer advantages in thermal stability and contact reliability compared to pure tin-based alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 64.14 | GPa | — | ||
| ↳ | 64.14 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.6409 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν) | 0.3252 | - | — | ||
Shear Modulus(G)2 entries | 25.37 | GPa | — | ||
| ↳ | 25.37 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.082 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2765 | eV/atom | — |