Sn3Au is an intermetallic compound in the tin-gold system, formed by the reaction of tin and gold at specific stoichiometric ratios. This material is primarily of research and specialized industrial interest, particularly in microelectronics and precious-metal joining applications where the thermal and mechanical properties of tin-gold phases offer advantages over conventional solder alloys or bulk gold in cost-sensitive precision applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3283 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1435 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.04372 | eV/atom | — |