Sn2PdAu

metal

· JVASP-106742· Sn2PdAu

Sn₂PdAu is a ternary intermetallic compound combining tin, palladium, and gold—a material family of interest primarily in electronic interconnect and metallurgical research. This alloy falls within the broader class of noble metal-tin systems studied for soldering, bonding, and high-reliability electronic applications where superior corrosion resistance and thermal stability compared to lead-based solders are required. The specific composition balances tin's wettability and cost-effectiveness with palladium and gold's oxidation resistance and reliability, making it relevant for microelectronic joining in demanding aerospace, medical device, and telecommunications environments.

solder and braze alloysmicroelectronic interconnectsflip-chip bondinglead-free electronicshigh-reliability aerospace applicationscorrosion-resistant coatings

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	10.16	kg/m³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.000	eV/atom	—
Formation Energy(ΔHf)	-0.3472	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Sn2PdAu

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control