Sn₂PdAu is a ternary intermetallic compound combining tin, palladium, and gold—a material family of interest primarily in electronic interconnect and metallurgical research. This alloy falls within the broader class of noble metal-tin systems studied for soldering, bonding, and high-reliability electronic applications where superior corrosion resistance and thermal stability compared to lead-based solders are required. The specific composition balances tin's wettability and cost-effectiveness with palladium and gold's oxidation resistance and reliability, making it relevant for microelectronic joining in demanding aerospace, medical device, and telecommunications environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.16 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.3472 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data