Sn2Pd2Au is a precious metal intermetallic compound combining tin, palladium, and gold in a defined stoichiometric ratio. This material belongs to the family of noble-metal-bearing alloys and is primarily investigated for advanced interconnect and bonding applications where chemical stability, corrosion resistance, and electrical conductivity are critical. Its use of palladium and gold makes it particularly relevant to electronics packaging and high-reliability joining, where it offers superior performance over conventional solders in demanding thermal and chemical environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.64 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03870 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.3589 | eV/atom | — |