Sn₁Hf₁Pt₁ is an intermetallic compound combining tin, hafnium, and platinum in equiatomic proportions, classified as a semiconductor material. This ternary compound is primarily of research and development interest, explored for potential applications requiring the combined properties of refractory metals (hafnium, platinum) with tin's semiconductor characteristics. The material belongs to the family of high-entropy and multi-principal-element alloys, which are investigated for extreme environments, advanced electronics, and catalytic applications where conventional binary or single-element systems reach performance limits.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 15,538.3 | ksi | — | ||
Shear Modulus(G) | -2,033.4 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01570 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3020 | eV/atom | — |