Sn1 Au5
semiconductor· Sn1 Au5
Sn₁Au₅ is an intermetallic compound combining tin and gold in a 1:5 atomic ratio, belonging to the class of precious-metal intermetallics used primarily in microelectronics and optoelectronics. This material is employed in bonding, contact, and barrier applications where its combination of gold's corrosion resistance and tin's lower cost provides cost-effective performance in demanding thermal and electrical environments. It is particularly relevant for flip-chip assembly, wire bonding, and high-reliability interconnects where thermal cycling and oxidation resistance are critical.
microelectronic interconnectsflip-chip bondingwire bonding contactsthermal cycling applicationscorrosion-resistant coatingshigh-reliability electronics
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.