SiPAu is a silicon-gold intermetallic compound that belongs to the family of precious metal alloys used in microelectronics and advanced joining applications. This material combines silicon's semiconductor properties with gold's excellent conductivity and corrosion resistance, making it particularly valuable for high-reliability interconnects and bonding in integrated circuits where thermal stability and electrical performance are critical. SiPAu is notable for its use in wire bonding, flip-chip bonding, and die-attach applications in the semiconductor industry, where it offers superior performance over traditional lead-based solders in demanding thermal and mechanical environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2481 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.9300 | eV | DFT · OptB88vdW | ||
| ↳ | 1.203 | eV | DFT · TBmBJ | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 14.38 | - | DFT · OptB88vdW | ||
| ↳ | 11.59 | - | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 33.66 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.2068 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data