SiPAu

metal

· JVASP-107010· SiPAu

SiPAu is a silicon-gold intermetallic compound that belongs to the family of precious metal alloys used in microelectronics and advanced joining applications. This material combines silicon's semiconductor properties with gold's excellent conductivity and corrosion resistance, making it particularly valuable for high-reliability interconnects and bonding in integrated circuits where thermal stability and electrical performance are critical. SiPAu is notable for its use in wire bonding, flip-chip bonding, and die-attach applications in the semiconductor industry, where it offers superior performance over traditional lead-based solders in demanding thermal and mechanical environments.

semiconductor wire bondingmicroelectronic interconnectsflip-chip assemblyhigh-reliability die attachintegrated circuit packagingthermal interface materials

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	0.2481	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.9300	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.000	eV/atom	—
Formation Energy(ΔHf)	-0.2068	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

SiPAu

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control