SiPAu
metal· JVASP-107010· SiPAu
SiPAu is a silicon-gold intermetallic compound that belongs to the family of precious metal alloys used in microelectronics and advanced joining applications. This material combines silicon's semiconductor properties with gold's excellent conductivity and corrosion resistance, making it particularly valuable for high-reliability interconnects and bonding in integrated circuits where thermal stability and electrical performance are critical. SiPAu is notable for its use in wire bonding, flip-chip bonding, and die-attach applications in the semiconductor industry, where it offers superior performance over traditional lead-based solders in demanding thermal and mechanical environments.
semiconductor wire bondingmicroelectronic interconnectsflip-chip assemblyhigh-reliability die attachintegrated circuit packagingthermal interface materials
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.868 | kg/m³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.9300 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2068 | eV/atom | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.