SiBAu is a silicon-based metallic compound incorporating gold, belonging to the intermetallic alloy family. This material combines the structural properties of silicon with gold's chemical stability and conductivity, making it of primary interest in microelectronics, nanotechnology, and specialized bonding applications where both mechanical integrity and electrical performance are critical. The addition of gold to silicon systems is notable for enabling lower-temperature processing routes and enhanced reliability compared to conventional silicon-based interconnects, though SiBAu remains primarily used in research and advanced manufacturing contexts rather than high-volume production.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3134 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 5.160 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.9713 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.9515 | eV/atom | — |