SiAu3 is an intermetallic compound composed of silicon and gold, belonging to the family of precious metal silicides. This material is primarily of research and specialized industrial interest rather than a commodity engineering material, valued for its unique combination of metallic and intermetallic properties that emerge from silicon-gold interactions. Applications span microelectronics bonding, high-temperature contacts, and advanced material research where the thermal stability and electrical conductivity of gold combined with silicon's semiconducting characteristics offer distinct advantages over conventional solders or contact materials.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.5229 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2029 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.2017 | eV/atom | — |