Si₂Sc₁Cu₂ is an experimental ternary intermetallic compound combining silicon, scandium, and copper in a semiconductor classification. This material belongs to the family of transition metal silicides with copper doping, which are primarily investigated in research contexts for their potential in thermoelectric applications and high-temperature structural uses. The compound's notable characteristic is the incorporation of scandium—a rare earth element—which can enhance thermal stability and modify electronic properties compared to conventional binary Cu-Si systems, making it of interest in advanced materials development where thermal management and electronic performance are coupled requirements.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 17,246.6 | ksi | — | ||
Shear Modulus(G) | 8,999.2 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00170 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.4510 | eV/atom | — |