SiOs (silicon-osmium compound) is an experimental semiconductor material combining silicon with osmium, representing a research-phase intermetallic or compound semiconductor. While not yet established in mainstream industrial production, this material family is of interest for high-temperature electronics and specialized semiconductor applications where the properties of osmium—a dense, refractory transition metal—might enhance thermal stability or electronic performance beyond conventional Si-based devices.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 40,175.5 | ksi | — | ||
Shear Modulus(G) | 18,622.8 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00500 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.2080 | eV/atom | — |