ScPd₃ is an intermetallic ceramic compound combining scandium and palladium, representing a research-phase material within the family of transition metal intermetallics. This material exhibits high stiffness and density characteristics typical of metallic ceramics, making it of interest for applications demanding high elastic rigidity and thermal stability in specialized environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 22,578.6 | ksi | DFT | ||
| ↳ | 142.1 | ksi | DFT · OptB88vdW | ||
| ↳ | 22,578.6 | ksi | DFT · PBE | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | DFT · PBE | ||
Elastic Anisotropy(AU) | 1.212 | - | DFT · PBE | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | ksi | DFT · PBE | ||
Poisson's Ratio(ν)2 entries | 0.3600 | - | DFT · OptB88vdW | ||
| ↳ | 0.3385 | - | DFT · PBE | ||
Shear Modulus(G)3 entries | 8,174.1 | ksi | DFT | ||
| ↳ | 42.06 | ksi | DFT · OptB88vdW | ||
| ↳ | 8,174.1 | ksi | DFT · PBE |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3423 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.000536 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.000531 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | 11.26 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 11.18 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00750 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.8771 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data