ScCuSn is a ternary intermetallic compound combining scandium, copper, and tin—a research-phase alloy system studied for its potential mechanical properties and stiffness characteristics. This material lies in the copper-tin-rare-earth family, which has been explored primarily in academic and advanced materials research rather than established commercial production. Engineers would consider this compound for applications requiring lightweight structural rigidity or specialized functional properties where scandium's strengthening effects and copper-tin's metallurgical heritage offer potential advantages over conventional brasses or copper alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 12,209 | ksi | — | ||
| ↳ | 12,209 | ksi | — | ||
| ↳ | 12,734.3 | ksi | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.1106 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | ksi | — | ||
Poisson's Ratio(ν)2 entries | 0.2332 | - | — | ||
| ↳ | 0.2400 | - | — | ||
Shear Modulus(G)3 entries | 7,924.5 | ksi | — | ||
| ↳ | 7,924.5 | ksi | — | ||
| ↳ | 7,855.2 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2359 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr) | 93.93 | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.2924 | C/m² | — | ||
Seebeck Coefficient(S) | -22.71 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.5617 | eV/atom | — |