Sc₃Sn₁B₁ is an intermetallic semiconductor compound combining scandium, tin, and boron in a defined stoichiometric ratio. This is a research-phase material within the broader family of ternary intermetallics; such compounds are investigated for potential applications requiring a combination of semiconducting behavior with ceramic-like mechanical properties. The material belongs to an exploratory class of compounds that may offer advantages in high-temperature electronics or specialized semiconductor applications where conventional silicon or III-V compounds are unsuitable, though practical industrial deployment remains limited pending further development and property characterization.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 12,376.5 | ksi | — | ||
Shear Modulus(G) | 10,080.1 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.08350 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.6460 | eV/atom | — |