S8 Ti4 Cu2 is a titanium-copper composite or alloy system with sulfur as a potential bonding or functional phase, likely in the semiconductor or advanced materials research domain. This material combination suggests applications in thermoelectric devices, photovoltaic systems, or specialized electronic components where the distinct properties of titanium, copper, and sulfur phases can be leveraged synergistically. The composition indicates a research-stage or emerging material rather than an established industrial standard, positioned for applications requiring tailored electrical, thermal, or structural properties beyond conventional binary alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 14,005.9 | ksi | — | ||
Shear Modulus(G) | 5,357.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01260 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -1.279 | eV/atom | — |