Polystyrene (PS) is a rigid, amorphous thermoplastic polymer widely used for its ease of processing, clarity, and cost-effectiveness. It is a standard engineering plastic found in consumer products, packaging, medical devices, and automotive components where moderate stiffness and dimensional stability are required. PS is valued for its processability via injection molding and extrusion, though its brittleness and lower impact resistance at low temperatures make it less suitable for demanding structural applications compared to toughened alternatives like ABS or polycarbonate.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Compressive Strength(σc) | 61.38 | ksi | — | ||
Elongation at Break(εf) | 28.41 | % | — | ||
Exfoliation Energy(Eexf) | 117.8 | meV/atom | DFT · OptB88vdW | ||
Flexural Strength (MOR)(σf) | 8.977 | ksi | — | ||
Hardness (Vickers)(HV) | 166.4 | HV | — | ||
Ultimate Tensile Strength(σUTS) | 3.841 | ksi | — | ||
Young's Modulus(E) | 228.9 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Glass Transition Temperature(Tg) | 207.8 | °F | — | ||
Melting Point / Solidus(Tm) | 295.7 | °F | — | ||
Maximum Service Temperature(Tmax) | 723.1 | °F | — | ||
Thermal Conductivity(k) | 0.1534 | BTU/(hr·ft·°F) | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.08082 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)3 entries | 3.559 | eV | — | ||
| ↳ | 1.929 | eV | DFT · OptB88vdW | ||
| ↳ | 2.624 | eV | DFT · TBmBJ | ||
Dielectric Constant (Relative Permittivity)(εr) | 6.488 | - | DFT · OptB88vdW | ||
High-Frequency Dielectric Constant (ε∞)(ε∞)2 entries | 7.429 | - | DFT · OptB88vdW | ||
| ↳ | 6.150 | - | DFT · TBmBJ | ||
Electron Effective Mass(m*e) | 1.923 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 1.663 | me | DFT · OptB88vdW · 27°C | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Piezoelectric Modulus(eij) | 0.000 | C/m² | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.00143 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.00150 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -376.7 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 285.9 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Spectroscopic Limited Maximum Efficiency (SLME)(SLME) | 10.26 | % | DFT · TBmBJ |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Refractive Index(n) | 1.569 | - | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00220 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.1631 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data