This is a polymer-based dielectric material, likely an advanced thermoplastic or thermoset formulation engineered for electrical insulation applications where high dielectric constant is a design requirement. The material belongs to a family of polymers optimized for capacitive, high-frequency, or power conditioning systems where maintaining stable electrical properties under thermal and mechanical stress is critical. Typical applications include electronic packaging, capacitor films, high-voltage insulation layers, and RF/microwave circuit substrates where engineers need better charge storage or signal integrity compared to standard unfilled polymers.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Dielectric Constant (Relative Permittivity)(εr) | 3.360 range 3.310–3.410median of 2 measurements | - | — |