This is a high-dielectric-constant polymer material, likely an engineered thermoplastic or thermoset resin formulated to achieve elevated relative permittivity (dielectric constant ≈ 8.2) compared to conventional unfilled polymers. High-k polymers are developed for electrical and electronic applications where capacitive storage, signal coupling, or dielectric isolation at reduced thickness is advantageous—offering a balance between the processability of polymers and performance characteristics traditionally reserved for ceramics or composites.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Dielectric Constant (Relative Permittivity)(εr) | 4.015 range 3.790–4.240median of 2 measurements | - | — |