Polyimide (PI) is a high-performance engineering polymer characterized by exceptional thermal stability, mechanical strength, and chemical resistance across a wide temperature range. It is widely used in aerospace, automotive, electronics, and industrial applications where conventional polymers fail, including jet engine components, printed circuit boards, seals, bearings, and insulators. Engineers select PI when durability at elevated temperatures, dimensional stability, and resistance to oils and solvents are critical requirements that justify its higher cost relative to commodity plastics.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 19.94 | GPa | — | ||
Compressive Strength(σc) | 14.96 | MPa | — | ||
Elongation at Break(εf) | 15.28 | - | — | ||
Flexural Strength (MOR)(σf) | 122.9 | MPa | — | ||
Hardness (Vickers)(HV) | 891.2 | HV | — | ||
Poisson's Ratio(ν) | 0.2400 | - | — | ||
Shear Modulus(G) | 13.11 | GPa | — | ||
Ultimate Tensile Strength(σUTS) | 111.7 | MPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Glass Transition Temperature(Tg) | 536.7 | K | — | ||
Melting Point / Solidus(Tm) | 518.3 | K | — | ||
Maximum Service Temperature(Tmax) | 779.4 | K | — | ||
Thermal Conductivity(k) | 0.6848 | W/(m·K) | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 4.150 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 2.594 | eV | — | ||
| ↳ | 0.8240 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1102 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.07243 | eV/atom | — | ||
Refractive Index(n) | 1.681 | - | — |