NiSn7
metal· JVASP-122593· NiSn7
NiSn7 is a nickel-tin intermetallic compound containing approximately 7 wt% tin, belonging to the nickel-tin binary alloy system. This material is primarily encountered in electronic packaging and plating applications, where it serves as a barrier layer or bonding phase in solder joints and metallurgical coatings; it is valued for its relatively high melting point and resistance to diffusion compared to conventional tin-based solders, making it relevant in high-reliability electronics and automotive interconnect systems.
electronics interconnectssolder barrier layersthermal management packaginghigh-reliability platingautomotive power modulesflip-chip assembly
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2033 | lb/in³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1696 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.1089 | eV/atom | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.