NiSn7

metal

· JVASP-122593· NiSn7

NiSn7 is a nickel-tin intermetallic compound containing approximately 7 wt% tin, belonging to the nickel-tin binary alloy system. This material is primarily encountered in electronic packaging and plating applications, where it serves as a barrier layer or bonding phase in solder joints and metallurgical coatings; it is valued for its relatively high melting point and resistance to diffusion compared to conventional tin-based solders, making it relevant in high-reliability electronics and automotive interconnect systems.

electronics interconnectssolder barrier layersthermal management packaginghigh-reliability platingautomotive power modulesflip-chip assembly

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	0.2033	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.1696	eV/atom	—
Formation Energy(ΔHf)	0.1089	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

NiSn7

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control