NiSn2Au
metal· JVASP-101648· NiSn2Au
NiSn2Au is a ternary intermetallic compound combining nickel, tin, and gold, likely developed for specialized joining or coating applications where corrosion resistance and thermal stability are critical. This material family is primarily researched for electronics packaging, solder alternatives, and high-reliability interconnect systems where traditional lead-based solders or pure tin-based compositions may be inadequate. The gold content enhances wettability and reliability, making it notable for applications demanding superior creep resistance and thermal cycling performance compared to standard Sn-Ag-Cu lead-free solders.
Electronics interconnectsSolder alternativesHigh-reliability bondingThermal cycling resistanceMicroelectronic packagingCorrosion-resistant coatings
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3664 | lb/in³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2326 | eV/atom | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.