NiSn2Au

metal

· JVASP-101648· NiSn2Au

NiSn2Au is a ternary intermetallic compound combining nickel, tin, and gold, likely developed for specialized joining or coating applications where corrosion resistance and thermal stability are critical. This material family is primarily researched for electronics packaging, solder alternatives, and high-reliability interconnect systems where traditional lead-based solders or pure tin-based compositions may be inadequate. The gold content enhances wettability and reliability, making it notable for applications demanding superior creep resistance and thermal cycling performance compared to standard Sn-Ag-Cu lead-free solders.

Electronics interconnectsSolder alternativesHigh-reliability bondingThermal cycling resistanceMicroelectronic packagingCorrosion-resistant coatings

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	0.3664	lb/in³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.000	eV/atom	—
Formation Energy(ΔHf)	-0.2326	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

NiSn2Au

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control