Ni6 Sn2

semiconductor
· Ni6 Sn2

Ni6Sn2 is an intermetallic compound in the nickel-tin system, representing a defined stoichiometric phase rather than a conventional alloy. This material belongs to the family of ordered intermetallic phases that form between transition metals and main-group elements, typically studied in research contexts for fundamental metallurgical properties and potential industrial applications where stable, high-melting phases are advantageous. Ni6Sn2 is encountered primarily in printed circuit board (PCB) soldering, die-attach materials, and thermal interface applications where tin-nickel interactions occur naturally during processing or are intentionally engineered; it also appears in lead-free solder systems and diffusion barrier research. The compound's significance lies in its thermal stability and resistance to coarsening compared to soft solder phases, making it valuable in electronics packaging where reliability under thermal cycling is critical.

Lead-free solder systemsPCB intermetallic layersDie-attach materialsThermal cycling reliabilityDiffusion barriers in electronicsHigh-temperature interconnects

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Band Gap(Eg)
—
eV——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Formation Energy(ΔHf)
—
eV/atom——
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.