Ni3Sn4 is an intermetallic compound in the nickel-tin system, formed through solid-state reactions between nickel and tin at elevated temperatures. This material is primarily encountered in electronics packaging and solder interconnect applications, where it forms as a reaction layer (diffusion barrier) at interfaces between tin-based solders and nickel-plated copper substrates during reflow soldering. Engineers value Ni3Sn4 for its role in controlling interfacial microstructure and preventing excessive solder dissolution of the underlying nickel layer, though its brittleness relative to the surrounding solder matrix makes minimizing excessive layer growth a key design consideration in reliability-critical applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 14,277.2 | ksi | — | ||
Shear Modulus(G) | 6,889.1 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3034 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -3.563 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2082 | eV/atom | — |