Ni3Sn4

metal
· Ni3Sn4

Ni3Sn4 is an intermetallic compound in the nickel-tin system, formed through solid-state reactions between nickel and tin at elevated temperatures. This material is primarily encountered in electronics packaging and solder interconnect applications, where it forms as a reaction layer (diffusion barrier) at interfaces between tin-based solders and nickel-plated copper substrates during reflow soldering. Engineers value Ni3Sn4 for its role in controlling interfacial microstructure and preventing excessive solder dissolution of the underlying nickel layer, though its brittleness relative to the surrounding solder matrix makes minimizing excessive layer growth a key design consideration in reliability-critical applications.

solder joint interconnectselectronic packagingPCB assemblyinterfacial diffusion barrierslead-free solder systemsmicroelectronics reliability

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Bulk Modulus(K)
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Pa——
Shear Modulus(G)
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Pa——
Verified Unverified Low confidence (<80%) Link to source
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Density(ρ)
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kg/m³——
Verified Unverified Low confidence (<80%) Link to source
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Band Gap(Eg)
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Magnetic Moment(μB)
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µB——
Seebeck Coefficient(S)
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µV/K——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
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eV/atom——
Formation Energy(ΔHf)
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eV/atom——
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.