Ni₃Sb is an intermetallic compound in the nickel-antimony system, representing a stoichiometric phase that combines nickel's corrosion resistance and ductility with antimony's hardening effect. While not a mainstream engineering material in high-volume production, Ni₃Sb and related nickel-based intermetallics are of interest in research and specialized applications where extreme hardness, thermal stability, or unique electronic properties are required; it is typically encountered in thermoelectric systems, high-temperature structural studies, and materials science investigations into ordered intermetallic phases rather than general industrial use.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 23,870.9 | ksi | DFT | ||
| ↳ | 23,674.5 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.4600 | - | DFT · OptB88vdW | ||
Shear Modulus(G)2 entries | 7,166.2 | ksi | DFT | ||
| ↳ | 6,973.4 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3413 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.00106 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.00106 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | -16.13 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | -16.16 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.05640 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.06272 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data