Ni3 Sn4

semiconductor

· Ni3 Sn4

Ni₃Sn₄ is an intermetallic compound formed in the nickel-tin system, commonly encountered as a reaction layer in solder joints and electronic packaging applications. It serves a critical role in microelectronics and thermal management, where it forms at the interface between tin-based solders and nickel-plated substrates or leads, acting as a diffusion barrier and structural component in solder interconnects. Engineers must account for Ni₃Sn₄'s formation and mechanical behavior in high-reliability electronics, as it influences joint reliability under thermal cycling and mechanical stress—making it essential for design engineers specifying lead-free solder systems and surface finishes.

solder joint microstructurelead-free electronics packagingthermal interface layersmicroelectronic interconnectsprinted circuit board assemblyreliability engineering for electronics

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000600	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.2080	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ni3 Sn4

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control