Ni3Sn1 is an intermetallic compound in the nickel-tin system, belonging to a class of ordered metallic phases that combine nickel's corrosion resistance with tin's properties to create a brittle but thermally stable material. This compound is primarily of research and specialized industrial interest, particularly in electronic packaging and solder applications where its high melting point and chemical stability provide advantages over conventional soft solders. Ni3Sn1 represents an alternative approach to lead-free interconnects in microelectronics and thermal management contexts where conventional tin-based solders fall short in thermal cycling resistance or service temperature.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 23,568.6 range 23,500.9–23,636.4median of 2 measurements | ksi | — | ||
Shear Modulus(G) | 9,220 range 7,469.4–10,970.7median of 2 measurements | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.03395 range 0.00190–0.06600median of 2 measurements | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1415 range -0.1650–-0.1180median of 2 measurements | eV/atom | — |