Ni3 Sn1 N1

semiconductor

· Ni3 Sn1 N1

Ni₃Sn₁N₁ is an experimental intermetallic nitride compound combining nickel, tin, and nitrogen—a research material in the broader family of transition metal nitrides and intermetallics. While not yet commercialized at scale, this material is being investigated for high-temperature structural applications and electronic devices where the combination of metallic bonding (Ni-Sn) and covalent nitride character (N) may offer improved hardness, thermal stability, or functional electronic properties compared to conventional Ni-based alloys or binary tin compounds.

high-temperature structural coatings (research phase)semiconductor and optoelectronic devices (experimental)wear-resistant intermetallic compoundsthermal barrier material developmentadvanced alloy research

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	171.2	GPa	—
Shear Modulus(G)	43.92	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.03110	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.03200	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ni3 Sn1 N1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control