Ni3 Sn1
semiconductor· Ni3 Sn1
Ni3Sn1 is an intermetallic compound in the nickel-tin system, belonging to a class of ordered metallic phases that combine nickel's corrosion resistance with tin's properties to create a brittle but thermally stable material. This compound is primarily of research and specialized industrial interest, particularly in electronic packaging and solder applications where its high melting point and chemical stability provide advantages over conventional soft solders. Ni3Sn1 represents an alternative approach to lead-free interconnects in microelectronics and thermal management contexts where conventional tin-based solders fall short in thermal cycling resistance or service temperature.
lead-free solder alternativeselectronic packaging interconnectshigh-temperature thermal managementintermetallic bonding layersresearch compound developmentmicroelectronics assembly
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | — median of 2 measurements | Pa | — | — | |
Shear Modulus(G) | — median of 2 measurements | Pa | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — median of 2 measurements | eV | — | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — median of 2 measurements | eV/atom | — | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.