MnInCu2 is a ternary intermetallic compound combining manganese, indium, and copper in a fixed stoichiometric ratio. While not a mainstream commercial alloy, this material belongs to the family of intermetallic compounds that are actively researched for applications requiring specific electronic, magnetic, or mechanical properties that cannot be achieved in single-element metals or conventional binary alloys. The compound's relatively high density and elastic properties suggest potential interest in functional applications such as magnetocaloric devices, thermoelectric materials, or shape-memory alloy systems, though widespread industrial adoption data is limited and this remains primarily a research-stage material.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 15,268.1 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.4700 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 4,095.9 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2988 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | Measured | ||
Magnetic Moment(μB) | 3.716 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.0000871 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.0000804 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | 3.440 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 3.300 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1324 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf)2 entries | 0.1311 | eV/atom | DFT · OptB88vdW | ||
| ↳ | -0.1948 | eV/atom | Measured |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data