MnCuP is a ternary intermetallic compound combining manganese, copper, and phosphorus elements. While not a widely commercialized engineering material, compounds in the Mn-Cu-P system are of research interest for magnetic, electronic, or catalytic applications due to the distinct properties contributed by each constituent element. Engineers would consider materials from this family primarily in specialized research or development contexts where conventional alloys are inadequate.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2494 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 5.939 | µB | — | ||
Seebeck Coefficient(S) | 0.2000 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.2816 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.09460 | eV/atom | — |