Mn₁Cu₁Pd₂ is an intermetallic compound combining manganese, copper, and palladium in a 1:1:2 atomic ratio, classified as a semiconductor. This material represents an experimental research composition rather than an established commercial alloy; compounds in this ternary system are primarily of scientific interest for their electronic properties and potential catalytic applications. The palladium content suggests possible relevance to catalysis, hydrogen storage, or electronic device applications, while the intermetallic structure typically offers high strength and thermal stability compared to single-phase alloys.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 21,557.4 | ksi | — | ||
Shear Modulus(G) | 8,870.5 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01420 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1680 | eV/atom | — |