Mg2CuAg is an intermetallic compound combining magnesium, copper, and silver—a ternary system that bridges lightweight magnesium metallurgy with the conductivity and corrosion resistance of noble metals. This material is primarily of research and development interest rather than established production use, investigated for applications where magnesium's low density must be paired with enhanced electrical conductivity, thermal properties, or corrosion resistance that binary Mg alloys cannot provide. The copper-silver addition modifies the crystal structure and mechanical response compared to conventional Mg-Cu or Mg-Ag systems, making it a candidate for specialized aerospace, electronics, or biomedical device development where weight savings and functional properties must coexist.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 9,399.9 | ksi | — | ||
Poisson's Ratio(ν) | 0.4900 | - | — | ||
Shear Modulus(G) | 4,961.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1963 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.1825 | eV/atom | — |