Mg₁Cu₄Sn₁ is an intermetallic compound combining magnesium, copper, and tin—a ternary phase that falls within the broader family of Mg-Cu-Sn systems being explored for semiconductor and thermoelectric applications. This material is primarily of research interest rather than established industrial production, with potential relevance to advanced electronics, energy conversion, and lightweight structural-electronic hybrid devices where the combination of magnesium's low density and copper-tin's conductive properties could be leveraged.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01510 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1180 | eV/atom | — |