InSn3 is an intermetallic compound combining indium and tin, belonging to the ceramic/intermetallic materials class. This material is primarily of research and specialized industrial interest, particularly in electronics and thermal management applications where its unique phase stability and thermal properties offer potential advantages over conventional solders and interconnect materials. InSn3 is notable for its potential use in high-reliability electronic assemblies and as a candidate material for advanced solder systems, though it remains less common than more established binary tin-based alloys in mainstream production.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2522 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.06090 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.05956 | eV/atom | — |