InCu
metal· JVASP-79191· InCu
InCu is an intermetallic compound combining indium and copper, belonging to the family of metallic intermetallics that combine reactive and noble metals. This material is primarily investigated in research contexts for semiconductor packaging, bonding applications, and thermal management due to its potential for low-temperature processing and good wetting characteristics on oxide surfaces.
semiconductor packaging and die attachmentsolder alternativesthermal interface materialsbrazing and joining applicationsresearch-phase electronics manufacturing
Compliance & Regulations
?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2763 | lb/in³ | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
Verified Unverified Low confidence (<80%) Link to source
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03460 | eV/atom | — | ||
Formation Energy(ΔHf) | 0.03198 | eV/atom | — |
Verified Unverified Low confidence (<80%) Link to source
Regulatory Screening
Environmental
Export Control
RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.