InCu is an intermetallic compound combining indium and copper, belonging to the family of metallic intermetallics that combine reactive and noble metals. This material is primarily investigated in research contexts for semiconductor packaging, bonding applications, and thermal management due to its potential for low-temperature processing and good wetting characteristics on oxide surfaces.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 7.648 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03460 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.03198 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data