InCu

metal

· JVASP-79191· InCu

InCu is an intermetallic compound combining indium and copper, belonging to the family of metallic intermetallics that combine reactive and noble metals. This material is primarily investigated in research contexts for semiconductor packaging, bonding applications, and thermal management due to its potential for low-temperature processing and good wetting characteristics on oxide surfaces.

semiconductor packaging and die attachmentsolder alternativesthermal interface materialsbrazing and joining applicationsresearch-phase electronics manufacturing

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Density(ρ)	7.648	kg/m³	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.000	eV	—
Magnetic Moment(μB)	0.000	µB	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Energy Above Hull(ΔEhull)	0.03460	eV/atom	—
Formation Energy(ΔHf)	0.03198	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

InCu

Physical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control