InBiAu is a ternary metal alloy composed of indium, bismuth, and gold. This material belongs to the family of low-melting-point metallic systems and is primarily of research and specialized industrial interest rather than a commodity engineering material. The alloy is notably used in applications requiring low-temperature processing, soft soldering, thermal interface materials, and specialized joining applications where conventional solders are unsuitable; its composition positions it as an alternative to lead-based solders and cadmium-containing systems in temperature-sensitive or biocompatible applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3793 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.05870 | eV/atom | — |