InAg3 is an intermetallic compound composed of indium and silver, representing a brittle metallic phase used primarily in specialized joining and electrical applications. This material is encountered in solder metallurgy, microelectronics packaging, and thermal management systems where the indium-silver phase diagram produces beneficial properties at specific compositions. Engineers select InAg3-containing systems for their thermal conductivity and wetting characteristics in high-reliability applications, though the compound itself is typically a secondary phase in composite solder matrices rather than used in pure form.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 84.53 | GPa | — | ||
Poisson's Ratio(ν) | 0.3900 | - | — | ||
Shear Modulus(G) | 23.72 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.703 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.00500 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.01937 | eV/atom | — |