In3Sn3Au4

metal

· In3Sn3Au4

In₃Sn₃Au₄ is an intermetallic compound combining indium, tin, and gold—a ternary metallic system typically studied in the context of advanced solder materials and electronic packaging. This material belongs to the family of precious-metal-bearing solders and interconnect alloys, representing a research-phase composition explored for high-reliability microelectronic bonding where conventional lead-free solders may be insufficient.

microelectronic solderhigh-reliability interconnectsflip-chip bondingprecious metal solder researchthermal cycling resistanceaerospace electronics

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.2176	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

In3Sn3Au4

Other Properties

Regulatory Screening

Environmental

Export Control