HoSnPd2 is an intermetallic ceramic compound combining holmium, tin, and palladium elements, representing a rare-earth-transition metal system that has been investigated in materials science research. This compound belongs to the family of intermetallic ceramics that are typically explored for their potential in high-temperature applications, electronic materials, and specialized industrial processes where the combination of rare-earth and noble metal properties may offer unique functionality. While not yet established as a mainstream engineering material in commercial production, compounds of this compositional type are of interest to researchers exploring novel combinations of strength, thermal stability, and electronic properties for advanced application development.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 16,621.3 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.4200 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | 2,828.2 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3850 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | DFT · OptB88vdW | ||
| ↳ | 0.000 | eV | DFT · TBmBJ | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)2 entries | 0.000583 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.000601 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)2 entries | 11.25 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 11.39 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.8794 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data