HoSi2Au2 is an intermetallic compound combining holmium, silicon, and gold, representing a ternary metallic system with potential high-temperature applications. This is primarily a research-phase material studied for its thermal and electronic properties rather than an established commercial alloy; compounds in the rare-earth silicide–gold family are investigated for specialized high-temperature structural applications, thermoelectric devices, and electronic contact materials where the combination of refractory silicide behavior and noble metal properties offers potential advantages over conventional single-phase alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3954 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.08170 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.4873 | eV/atom | — |