HoCu is an intermetallic compound combining holmium (a rare-earth element) with copper, representing a research-stage material rather than a production alloy. This compound exists primarily in academic and experimental contexts, where researchers investigate rare-earth–copper systems for their potential electromagnetic, thermal, and structural properties. Interest in HoCu stems from the unique electronic and magnetic characteristics that rare-earth elements impart when bonded with transition metals like copper, making it relevant to materials scientists exploring advanced functional materials rather than conventional structural applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 11,236.1 | ksi | — | ||
Poisson's Ratio(ν) | 0.2900 | - | — | ||
Shear Modulus(G) | 5,401.2 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3385 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 9.520 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.3236 | eV/atom | — |