Ho₃Sn₃Pt₃ is an intermetallic compound combining holmium (rare earth), tin, and platinum in an equiatomic ratio, classified as a semiconductor with potential for thermoelectric or magnetic applications. This is primarily a research-phase material studied for its electronic structure and possible use in advanced functional devices, as the combination of rare earth and noble metal elements suggests interesting magnetic and transport properties. The material represents an experimental composition rather than an established industrial product, with relevance to materials research exploring rare earth-platinum intermetallics for next-generation electronic or thermal management systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 16,666.4 | ksi | — | ||
Shear Modulus(G) | 7,911.4 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00400 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -1.109 | eV/atom | — |