Ho₂Cu₂Sn₂ is an intermetallic semiconductor compound combining rare-earth (holmium), transition metal (copper), and main group (tin) elements. This material belongs to the family of ternary intermetallics that exhibit semiconducting behavior and is primarily of research and development interest rather than established industrial production. The compound's potential applications stem from its mixed-metal composition and electronic properties, making it relevant for exploratory work in thermoelectric devices, magnetoelectric applications, or advanced electronic materials where rare-earth intermetallics show promise.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 11,922.1 | ksi | — | ||
Shear Modulus(G) | 7,753.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01300 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.6220 | eV/atom | — |